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Tatsuta Electronic Materials Malaysia Sdn. Bhd.

No. 8 Jalan Pendaftar U1/54,Temasya Industrial Park,40150,Shah Alam,Selangor
www.tatsuta.com.my
+60355670715
temmsales@tatsuta.com

Company Profile

TATSUTA Electronic Materials Malaysia Sdn. Bhd. (TEMM), a subsidiary of the internationally renowned Tatsuta Electric Wire & Cable Co., Ltd. (Tatsuta) in Japan, has been conducting business in the Malaysia since its incorporation in 2012.
 
Tatsuta has a history of more than 35 years in the bonding wire business and has contributed to the production of high-quality semiconductors in Japan.  We, TEMM, brought Tatsuta’s high technology and quality to Malaysia and is manufacturing various bonding wires, such as bare Copper wire, Silver alloy wire, Pd coated Copper wire, Copper alloy wire.
 
TEMM has produced high quality bonding wires and we will continue to supply bonding wires with the customer-first spirit in Southeast Asia, China, Taiwan, which is one of the largest production base in the semiconductor industry.

One of TEMM’s main target is semiconductor for automotive. High reliability, quality, stable supply are required for Zero-Defect of semiconductor and stable operation of the customer’s factory.
TEMM strive to provide the stable supply of high-quality bonding wire to contribute to the high quality and stable supply of our customers.
 
TEMM can develop wires that meet the needs of our customers by unique technology.
  (1)   Alloying technology (ultra-high purity raw material, unique dopant…)
  (2)   Surface treatment technology 
  (3)   Heat treatment technology
  (4)   Production technology of ultra-fine wire.
 
We, TEMM, will continue to supply our customers with highly reliable and high-quality bonding wires and contribute to the development of the semiconductor industry.
 
And TEMM can supply our ultra-fine wire for industries other than semiconductors.
If you can use our ultra-fine wires for applications other than semiconductors, please feel free to contact us. We can develop suitable ultra-fine metal wire for its application

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